Patents/Inventors

Sairam Agraharam

Chandler, AZUS18 patents

17 Patents

US125819882026
Microelectronic Assemblies with Through Die Attach Film Connections
Intel Corporation
0 cites
US125640902026
Edge-aligned Template Structure for Integrated Packages Including an Integrated Circuit Device Within an Opening of the Template Structure
Intel Corporation
0 cites
US124762352025
Multi-chip Packaging
Intel Corporation
0 cites
US124698012025
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly
Intel Corporation
0 cites
US123344722025
Multiple Wafer Stack Architecture to Enable Singulation
Intel Corporation
0 cites
US122437922025
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US121990852025
Multi-chip Packaging
Intel Corporation
0 cites
US121762682024
Open Cavity Bridge Co-planar Placement Architectures and Processes
Intel Corporation
0 cites
US121702532024
Metal-free Frame Design for Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites
US121193172024
Singulation of Microelectronic Components with Direct Bonding Interfaces
Intel Corporation
0 cites
US120741212024
Metal-free Frame Design for Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites
US120274482024
Open Cavity Bridge Power Delivery Architectures and Processes
Intel Corporation
0 cites
US118879622024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US118174442023
Multi-chip Packaging
Intel Corporation
0 cites
US118044702023
Wafer Level Passive Heat Spreader Interposer to Enable Improved Thermal Solution for Stacked Dies in Multi-chips Package and Warpage Control
Intel Corporation
0 cites
US117912742023
Multichip Semiconductor Package Including a Bridge Die Disposed in a Cavity Having Non-planar Interconnects
Intel Corporation
0 cites
US116263722023
Metal-free Frame Design for Silicon Bridges for Semiconductor Packages
Intel Corporation
0 cites