19 Patents
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- US125557142026Device, Method, and System to Provide Passivation Structures of a Magnetic Material Based Inductor
Intel Corporation
0 cites - US124811082025Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
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- US123278142025Electronic Substrate Core Having an Embedded Laser Stop to Control Depth of an Ultra-deep Cavity
Intel Corporation
0 cites - US121547152024Methods to Selectively Embed Magnetic Materials in Substrate and Corresponding Structures
Intel Corporation
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- US118814632024Coreless Organic Packages with Embedded Die and Magnetic Inductor Structures
Intel Corporation
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- US117355372023Methods to Embed Magnetic Material as First Layer on Coreless Substrates and Corresponding Structures
Intel Corporation
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- US116107062023Release Layer-assisted Selective Embedding of Magnetic Material in Cored and Coreless Organic Substrates
Intel Corporation
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