Patents/Inventors

Ryuya Koizumi

TokyoJP3 patents

4 Patents

US122718132025
Method for Determining Optimal Number of Submodules for Use in Semiconductor Manufacturing Apparatus Including Substrate Processing Module Including Plurality of Submodules, and Semiconductor Manufacturing Apparatus
EBARA CORPORATION
0 cites
US122217142025
Plating Method and Plating Apparatus
EBARA CORPORATION
0 cites
US121911782025
Semiconductor Manufacturing Apparatus, Failure Prediction Method for Semiconductor Manufacturing Apparatus, and Failure Prediction Program for Semiconductor Manufacturing Apparatus
EBARA CORPORATION
0 cites
US120548412024
Apparatus for Plating and Method of Plating
EBARA CORPORATION
0 cites