Patents/Inventors

Ryunosuke Nomura

AnnakaJP6 patents

6 Patents

US125402222026
Fluoroplastic Substrate for High-speed Communications and Copper-clad Fluoroplastic Substrate for High-speed Communications
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US121163042024
Method for Packing Quartz Glass Cloth
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US120354612024
Low Dielectric Substrate for High-speed Millimeter-wave Communication
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US119743892024
Low Dielectric Substrate for High-speed Millimeter-wave Communication
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US119200112024
Resin Substrate Having Dielectric Characteristics with Little Frequency Dependence
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US116784322023
Low Dielectric Substrate for High-speed Millimeter-wave Communication
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites