Patents/Inventors

Ryuji Akebi

TokyoJP1 patent

2 Patents

US123241052025
Maleimide Resin Composition, Prepreg, Resin Film, Laminated Board, Printed Wiring Board, and Semiconductor Package
Resonac Corporation
0 cites
US120246242024
Maleimide Resin Composition, Prepreg, Laminated Board, Resin Film, Printed Wiring Board, and Semiconductor Package
RESONAC CORPORATION
0 cites