Patents/Inventors

Ryohei Yumoto

SaitamaJP1 patent

2 Patents

US123565542025
Method for Manufacturing Bonded Body and Method for Manufacturing Insulation Circuit Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites
US119087682024
Method of Manufacturing Bonded Body for Insulation Circuit Substrate Board and Bonded Body for Insulation Circuit Substrate Board
MITSUBISHI MATERIALS CORPORATION
0 cites