Ryo Katou

2 Patents

• US125346512026

  Electrically Conductive Adhesive, Sintered Body of Electrically Conductive Adhesive, Method for Producing Sintered Body, Electronic Component, and Method for Producing Electronic Component

  Osaka Soda Co., Ltd.

  0 cites
• US124419172025

  Electroconductive Adhesive

  OSAKA SODA CO., Ltd.

  0 cites