Patents/Inventors

Ryan John Lewis

Boulder, COUS4 patents

5 Patents

US126074132026
Polymer-based Microfabricated Thermal Ground Plane
KELVIN THERMAL TECHNOLOGIES, Inc.
0 cites
US124981812025
Vapor Chamber
Kelvin Thermal Technologies, Inc.
0 cites
US123856972025
Micropillar-enabled Thermal Ground Plane
Kelvin Thermal Technologies, Inc.
0 cites
US121048562024
Method and Device for Optimization of Vapor Transport in a Thermal Ground Plane Using Void Space in Mobile Systems
THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
0 cites
US115985942023
Micropillar-enabled Thermal Ground Plane
THE REGENTS OF THE UNIVERSITY OF COLORADO
0 cites