14 Patents
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- US118090282023Electro-optic Modulator Utilizing Copper-tungsten Electrodes for Improved Thermal Stability and Method of Forming the Same
II-VI Delaware, Inc.
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- US116513732023Edge-computing-based Bottom-up Hierarchical Architecture for Data Administration in a Digital Network
Bank Of America Corporation
0 cites - US116400752023Electro-optic Modulator Utilizing Copper-tungsten Electrodes for Improved Thermal Stability
II-VI Delaware, Inc.
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