4 Patents
- US124068962025Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor
NXP USA, Inc.
0 cites - US119358092024Semiconductor Package Thermal Spreader Having Integrated EF/EMI Shielding and Antenna Elements
NXP USA, Inc.
0 cites - US118173662023Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor
NXP USA, Inc.
0 cites - US115575252023Semiconductor Package Thermal Spreader Having Integrated RF/EMI Shielding and Antenna Elements
NXP USA, Inc.
0 cites