Rui Tze Toh

7 Patents

• US125753942026

  Three-dimensional Integrated Circuit with Top Chip Including Local Interconnect for Body-source Coupling

  Globalfoundries U.S. Inc.

  0 cites
• US125640292026

  Contact via Structures of Semiconductor Devices

  GLOBALFOUNDRIES Singapore Pte. Ltd.

  0 cites
• US125001192025

  Air Gap with Inverted T-shaped Lower Portion Extending Through at Least One Metal Layer, and Related Method

  Globalfoundries Singapore Pte. Ltd.

  0 cites
• US123494442025

  Under-source Body Contact

  GLOBALFOUNDRIES Singapore Pte. Ltd

  0 cites
• US123277762025

  Heat Sink for Face Bonded Semiconductor Device

  Globalfoundries Singapore Pte. Ltd.

  0 cites
• US122119292025

  Heterojunction Bipolar Transistors with Terminals Having a Non-planar Arrangement

  Globalfoundries U.S. Inc.

  0 cites
• US117768442023

  Contact via Structures of Semiconductor Devices

  GLOBALFOUNDRIES SINGAPORE PTE. Ltd.

  0 cites