5 Patents
- US122781882025Different via Configurations for Different via Interface Requirements
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121764352024Method for Forming Fin Field Effect Transistor (finfet) Device Structure with Conductive Layer Between Gate and Gate Contact
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121425652024Different via Configurations for Different via Interface Requirements
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd
0 cites - US119086972024Interconnect Structure Having a Carbon-containing Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
0 cites - US118551542023Vertical Interconnect Features and Methods of Forming
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites