Ru-liang Lee

12 Patents

• US125576102026

  Multilayer Isolation Structure for High Voltage Silicon-on-insulator Device

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US124713792025

  Multi-function Substrate

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123693522025

  Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusion Barrier Layer

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US122305852025

  Photolithography Alignment Process for Bonded Wafers

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122117372025

  Cleaning Chamber for Metal Oxide Removal

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US121130712024

  Multi-function Substrate

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US120402212024

  Fabrication Method of Metal-free SOI Wafer

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119160222024

  Photolithography Alignment Process for Bonded Wafers

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118045312023

  Thin Film Transfer Using Substrate with Etch Stop Layer and Diffusion Barrier Layer

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US117356242023

  Multi-lateral Recessed MIM Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117217522023

  Semiconductor Device Having Doped Seed Layer and Method of Manufacturing the Same

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US116825782023

  Multilayer Isolation Structure for High Voltage Silicon-on-insulator Device

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites