Roy R. Yu

7 Patents

• US124567092025

  Structures and Processes for Void-free Hybrid Bonding

  International Business Machines Corporation

  0 cites
• US121366552024

  Backside Electrical Contacts to Buried Power Rails

  International Business Machines Corporation

  0 cites
• US121069692024

  Substrate Thinning for a Backside Power Distribution Network

  International Business Machines Corporation

  0 cites
• US120231622024

  Three-dimensional Silicon-based Comb Probe with Optimized Biocompatible Dimensions for Neural Sensing and Stimulation

  Yale University

  0 cites
• US120027582024

  Backside Metal-insulator-metal (MIM) Capacitors Extending Through Backside Interlayer Dielectric (BILD) Layer or Semiconductor Layer and Partly Through Dielectric Layer

  International Business Machines Corporation

  0 cites
• US119159662024

  Backside Power Rail Integration

  International Business Machines Corporation

  0 cites
• US115629072023

  Nanostructure Featuring Nano-topography with Optimized Electrical and Biochemical Properties

  International Business Machines Corporation

  0 cites