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Roy Dittler
Chandler, AZ
US
2 patents
3 Patents
US12416093
2025
Electroless Plating Process
Intel Corporation
0 cites
US12159844
2024
Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US11791228
2023
Method for Forming Embedded Grounding Planes on Interconnect Layers
Intel Corporation
0 cites