Patents/Inventors

Rongjun Wang

Dublin, CAUS26 patents

24 Patents

US125884432026
Methods for Forming Low Resistivity Contacts
Applied Materials Inc.
0 cites
US125688042026
Method of In-situ Selective Metal Removal via Gradient Oxidation for Gapfill
Applied Materials, Inc.
0 cites
US124736432025
Low Resistivity Gapfill for Logic Devices
Applied Materials, Inc.
0 cites
US124085572025
Methods for Forming Structures with Desired Crystallinity for MRAM Applications
Applied Materials, Inc.
0 cites
US124025352025
Magnetic Tunnel Junctions with Tunable High Perpendicular Magnetic Anisotropy
Applied Materials, Inc.
0 cites
US123946192025
Metal Oxide Preclean for Bottom-up Gapfill in MEOL and BEOL
APPLIED MATERIALS, Inc.
0 cites
US123745682025
One Chamber Multi-station Selective Metal Removal
APPLIED MATERIALS, Inc.
0 cites
US123385272025
Shutter Disk for Physical Vapor Deposition (PVD) Chamber
APPLIED MATERIALS, Inc.
0 cites
US122725512025
Selective Metal Removal with Flowable Polymer
Applied Materials, Inc.
0 cites
US122726592025
Methods for Forming Metal Gapfill with Low Resistivity
APPLIED MATERIALS, Inc.
0 cites
US121128902024
Top Magnets for Decreased Non-uniformity in PVD
Applied Materials, Inc.
0 cites
US120946992024
Methods and Apparatus for Controlling Ion Fraction in Physical Vapor Deposition Processes
APPLIED MATERIALS, Inc.
0 cites
US120158282024
Content Sharing Method and Apparatus
DINGTALK HOLDING (CAYMAN) LIMITED
0 cites
US118982362024
Methods and Apparatus for Processing a Substrate
APPLIED MATERIALS, Inc.
0 cites
US118912612024
Device and Method for Detecting Flatness of Sheet Material
TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
0 cites
US118556612023
Multiplier and Operator Circuit
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US118107702023
Methods and Apparatus for Controlling Ion Fraction in Physical Vapor Deposition Processes
APPLIED MATERIALS, Inc.
0 cites
US117806242023
Device for Binding Rod Bundles
HIGH-END EQUIPMENT AND RAIL TRANSIT TECHNOLOGY R & D CENTER OF HARAN TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
0 cites
US116371072023
Silicon-containing Layer for Bit Line Resistance Reduction
APPLIED MATERIALS, Inc.
0 cites
US116232592023
System for Flattening Steel Plates
TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
0 cites
US116264102023
Silicon-containing Layer for Bit Line Resistance Reduction
APPLIED MATERIALS, Inc.
0 cites
US115750712023
Oxygen Controlled PVD ALN Buffer for Gan-based Optoelectronic and Electronic Devices
Applied Materials, Inc.
0 cites
US115522442023
Magnetic Tunnel Junction Structures and Methods of Manufacture Thereof
Applied Materials, Inc.
0 cites
US115425892023
Resistance-area (RA) Control in Layers Deposited in Physical Vapor Deposition Chamber
APPLIED MATERIALS, Inc.
0 cites