3 Patents
- US121598232024Semiconductor Package with Front Side and Back Side Redistribution Structures and Fabricating Method Thereof
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites - US120516112024Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US116520382023Semiconductor Package with Front Side and Back Side Redistribution Structures and Fabricating Method Thereof
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites