9 Patents
- US125766332026Matching Electrically Conductive Line Resistances to Switches in Fluidic Dies
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
- US123116612025Integrated Circuits Including High-voltage High-power and High-voltage Low-power Supply Nodes
Hewlett-packard Development Company, L.P.
0 cites - US122336452025Fluidic Die Having Trickle-warming and Pulse-warming Circuits
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
- US119517392024Fluidic Die with High Aspect Ratio Power Bond Pads
Hewlett-packard Development Company, L.P.
0 cites - 0 cites
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- US116339492023Fluid Actuators Connected to Field Effect Transistors
Hewlett-packard Development Company, L.P.
0 cites