14 Patents
- 0 cites
- US125001982025Quad Flat No-lead (QFN) Package with Tie Bars and Direct Contact Interconnect Build-up Structure and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US125001972025Encapsulant-defined Land Grid Array (LGA) Package and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US124697762025Semiconductor Assembly Comprising a 3D Block and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US124380652025Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US123005612025Fully Molded Structure with Multi-height Components Comprising Backside Conductive Material and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US122058812025Semiconductor Assembly Comprising a 3D Block and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US121702612024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US120625502024Molded Direct Contact Interconnect Substrate and Methods of Making Same
Deca Technologies USA, Inc.
0 cites - US120573732024Stackable Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US119730512024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US117495342023Quad Flat No-lead (QFN) Package Without Leadframe and Direct Contact Interconnect Build-up Structure and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US117282482023Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites - US116160032023Stackable Fully Molded Semiconductor Structure with Through Silicon via (TSV) Vertical Interconnects
Deca Technologies USA, Inc.
0 cites