9 Patents
- US125576472026Semiconductor Package, Method of Forming the Package and Electronic Device
SHENZHEN STS MICROELECTRONICS CO., Ltd.
0 cites - US124566292025Method of Producing Substrates for Semiconductor Device Packages Comprising Anchoring Encapsulation to Die Pad
Stmicroelectronics S.r.l.
0 cites - US123813722025Electronic Module for Generating Light Pulses for LIDAR Applications and Method for Manufacturing the Electronic Module
Stmicroelectronics Application GmbH
0 cites - US123226032025Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device
Stmicroelectronics S.r.l.
0 cites - US123226842025Method of Manufacturing Electronic Devices and Corresponding Electronic Device
Stmicroelectronics Pte Ltd
0 cites - US120402632024Semiconductor Device with Die Mounted to an Insulating Substrate and Corresponding Method of Manufacturing Semiconductor Devices
Stmicroelectronics S.r.l.
0 cites - 0 cites
- US116263792023Method of Manufacturing Semiconductor Devices and Corresponding Semiconductor Device
STMICROELECTRONICS S.r.l.
0 cites - US115575472023Leadframe for Semiconductor Devices, Corresponding Semiconductor Product and Method
Stmicroelectronics S.r.l.
0 cites