Patents/Inventors

Robert Sankman

Phoenix, AZUS20 patents

21 Patents

US123477832025
Interconnect Architecture with Silicon Interposer and EMIB
Intel Corporation
0 cites
US123410802025
Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites
US122726562025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US122064102025
Programmable Logic Device with Fine-grained Disaggregation
Intel Corporation
0 cites
US121990482025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US121487032024
EMIB Patch on Glass Laminate Substrate
Intel Corporation
0 cites
US120030232024
In-package 3D Antenna
Intel Corporation
0 cites
US119786892024
Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites
US119787272024
Package on Active Silicon Semiconductor Packages
Intel Corporation
0 cites
US119159962024
Microelectronics Assembly Including Top and Bottom Packages in Stacked Configuration with Shared Cooling
Intel Corporation
0 cites
US119012992024
Interconnect Architecture with Silicon Interposer and EMIB
Intel Corporation
0 cites
US118240182023
Heterogeneous Nested Interposer Package for IC Chips
0 cites
US117568602023
Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites
US117355332023
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US116581222023
EMIB Patch on Glass Laminate Substrate
Intel Corporation
0 cites
US116520202023
Thermal Solutions for Multi-package Assemblies and Methods for Fabricating the Same
Intel Corporation
0 cites
US116520572023
Disaggregated Die Interconnection with On-silicon Cavity Bridge
Intel Corporation
0 cites
US116108562023
Connectivity Between Integrated Circuit Dice in a Multi-chip Package
Intel Corporation
0 cites
US115950452023
Programmable Logic Device with Fine-grained Disaggregation
Intel Corporation
0 cites
US115812872023
Chip Scale Thin 3D Die Stacked Package
Intel Corporation
0 cites
US115575412023
Interconnect Architecture with Silicon Interposer and EMIB
Intel Corporation
0 cites