21 Patents
- US125989702026Top via on Subtractively Etched Conductive Line
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US125688062026Conformal Dielectric Cap for Subtractive Vias
International Business Machines Corporation
0 cites - US124329602025Wraparound Contact with Reduced Distance to Channel
International Business Machines Corporation
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- US124025462025Composite Material Phase Change Memory Cell
International Business Machines Corporation
0 cites - US123566852025Looped Long Channel Field-effect Transistor
International Business Machines Corporation
0 cites - US122680302025Self-aligned C-shaped Vertical Field Effect Transistor
International Business Machines Corporation
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- US119904102024Top via Interconnect Having a Line with a Reduced Bottom Dimension
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US119617592024Interconnects Having Spacers for Improved Top via Critical Dimension and Overlay Tolerance
INTERNATIONAL BUSINESS MACHINES CORPORATION
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- US118239982023Top via with Next Level Line Selective Growth
International Business Machines Corporation
0 cites - US118044062023Top via Cut Fill Process for Line Extension Reduction
International Business Machines Corporation
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- US117570122023Source and Drain Contact Cut Last Process to Enable Wrap-around-contact
International Business Machines Corporation
0 cites - US116826172023High Aspect Ratio Vias for Integrated Circuits
International Business Machines Corporation
0 cites - US116705422023Stepped Top via for via Resistance Reduction
International Business Machines Corporation
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