Patents/Inventors

Robert Nickerson

Chandler, AZUS3 patents

3 Patents

US125576832026
Solder Grid Array for Attachment of a Die Package
Intel Corporation
0 cites
US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites