Patents/Inventors

Robert M. Nickerson

Chandler, AZUS19 patents

11 Patents

US126047202026
Through Mold Interconnect Drill Feature
Intel Corporation
0 cites
US124179582025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US124069062025
Through Mold Interconnect Drill Feature
Intel Corporation
0 cites
US123947732025
Laser Ablation-based Surface Property Modification and Contamination Removal
Intel Corporation
0 cites
US123623402025
Laser Ablation-based Surface Property Modification and Contamination Removal
Intel Corporation
0 cites
US123477432025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123157772025
Microelectronics Package Comprising a Package-on-package (POP) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and POP Adhesive Keep Out Zone
Intel Corporation
0 cites
US121070822024
Offset Interposers for Large-bottom Packages and Large-die Package-on-package Structures
Intel Corporation
0 cites
US119787302024
Offset Interposers for Large-bottom Packages and Large-die Package-on-package Structures
Intel Corporation
0 cites
US117989322023
Offset Interposers for Large-bottom Packages and Large-die Package-on-package Structures
Intel Corporation
0 cites
US117053832023
Through Mold Interconnect Drill Feature
Intel Corporation
0 cites