Patents/Inventors

Robert L. Sankman

Phoenix, AZUS33 patents

31 Patents

US125923342026
Stacked Magnetic Inductor and Method
Intel Corporation
0 cites
US125869062026
Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites
US125576652026
Embedded Semiconductive Chips in Reconstituted Wafers, and Systems Containing Same
Intel Corporation
0 cites
US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124762352025
Multi-chip Packaging
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US123879992025
Planar Integrated Circuit Package Interconnects
Intel Corporation
0 cites
US123411292025
Substrateless Double-sided Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US123342422025
Coreless Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US123006202025
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US122611242025
Embedded Die Architecture and Method of Making
Intel Corporation
0 cites
US122242452025
Embedded Die Architecture and Method of Making
Intel Corporation
0 cites
US121990852025
Multi-chip Packaging
Intel Corporation
0 cites
US121425682024
Multi-die Ultrafine Pitch Patch Architecture of Interconnect Bridge Over Glass Layer and Method of Making
Intel Corporation
0 cites
US120465602024
Microelectronic Device with Embedded Die Substrate on Interposer
Intel Corporation
0 cites
US120027452024
High Performance Integrated RF Passives Using Dual Lithography Process
Intel Corporation
0 cites
US119786852024
Glass Core Patch with in Situ Fabricated Fan-out Layer to Enable Die Tiling Applications
Intel Corporation
0 cites
US119232572024
Hybrid Microelectronic Substrates
Intel Corporation
0 cites
US119012482024
Embedded Die Architecture and Method of Making
Intel Corporation
0 cites
US118943112024
Microelectronic Device with Embedded Die Substrate on Interposer
Intel Corporation
0 cites
US118943592024
Distributed Semiconductor Die and Package Architecture
Intel Corporation
0 cites
US118698422024
Scalable High Speed High Bandwidth IO Signaling Package Architecture and Method of Making
Intel Corporation
0 cites
US118701632024
Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites
US118324192023
Full Package Vapor Chamber with IHS
Intel Corporation
0 cites
US118174442023
Multi-chip Packaging
Intel Corporation
0 cites
US117988872023
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US117641582023
Embedded Multi-die Interconnect Bridge Packages with Lithographically Formed Bumps and Methods of Assembling Same
Intel Corporation
0 cites
US117568892023
Ultrathin Bridge and Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites
US117053772023
Stacked Die Cavity Package
Intel Corporation
0 cites
US116949592023
Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites
US116263952023
Thermal Spreading Management of 3D Stacked Integrated Circuits
Intel Corporation
0 cites