11 Patents
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- US124314452025Methods Related to Dual-sided Module with Land-grid Array (LGA) Footprint
Skyworks Solutions, Inc.
0 cites - US121912412025Fine Pitch Copper Pillar Package and Method
Amkor Technology Singapore Holding Pte. Ltd.
0 cites - US120339542024Packaged Module with Ball Grid Array and Grounding Pins for Signal Isolation, Method of Manufacturing the Same, and Wireless Device Comprising the Same
Skyworks Solutions, Inc.
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- US119618052024Devices and Methods Related to Dual-sided Radio-frequency Package with Overmold Structure
Skyworks Solutions, Inc.
0 cites - US118943232024Devices Related to Dual-sided Module with Land-grid Array (LGA) Footprint
Skyworks Solutions, Inc.
0 cites - 0 cites
- US115960562023Methods and Devices Related to Reduced Packaging Substrate Deformation
Skyworks Solutions, Inc.
0 cites - US115454052023Packaging for Fingerprint Sensors and Methods of Manufacture
Amkor Technology Singapore Holding Pte. Ltd.
0 cites