Patents/Inventors

Robert Felix Bywalez

MunichDE3 patents

4 Patents

US124518612025
Wafer Level Package
RF360 Singapore Pte. Ltd.
0 cites
US120741202024
Electric Component with Pad for a Bump and Manufacturing Method Thereof
RF360 Singapore Pte. Ltd.
0 cites
US119848712024
Package Comprising Stacked Filters
RF360 SINGAPORE PTE. Ltd.
0 cites
US119679382024
Corrosion Resistant Pad for Enhanced Thin Film Acoustic Packaging (TFAP)
RF360 SINGAPORE PTE. Ltd.
0 cites