17 Patents
- US124811082025Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
0 cites - US123006132025Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites - US121762922024Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - 0 cites
- US120402762024Device and Method of Very High Density Routing Used with Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites - US120149892024Device and Method of Very High Density Routing Used with Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites - 0 cites
- 0 cites
- US119012962024Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites - 0 cites
- 0 cites
- US118173902023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US117841282023Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites - US117641582023Embedded Multi-die Interconnect Bridge Packages with Lithographically Formed Bumps and Methods of Assembling Same
Intel Corporation
0 cites - 0 cites
- US116886922023Embedded Multi-die Interconnect Bridge Having a Substrate with Conductive Pathways and a Molded Material Region with Through-mold Vias
Intel Corporation
0 cites - US116409422023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites