Patents/Inventors

Rita J. Klein

Boise, IDUS22 patents

22 Patents

US125435592026
Memory Device Including Control Gates Having Tungsten Structure
Micron Technology, Inc.
0 cites
US124697782025
Methods Used in Forming a Memory Array Comprising Strings of Memory Cells and Memory Arrays Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US124245532025
Memory Device Including Control Gates Having Tungsten Structure
Micron Technology, Inc.
0 cites
US124084142025
Transistor and Memory Circuitry Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US123811532025
Microelectronic Devices, Memory Devices, and Electronic Systems
0 cites
US123681012025
Apparatuses Including Interconnect Structures Including Dielectric Material Surrounded by Conductive Material, and Related Memory Devices
Battelle Energy Alliance, LLC
0 cites
US123224432025
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US122951402025
Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
Micron Technology, Inc.
0 cites
US122508122025
Integrated Assemblies and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US121702502024
Microelectronic Devices and Memory Devices Including Conductive Levels Having Varying Compositions
Micron Technology, Inc.
0 cites
US120966332024
Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells
0 cites
US120340572024
Assemblies Which Include Wordlines Having a First Metal-containing Material at Least Partially Surrounding a Second Metal-containing Material and Having Different Crystallinity Than the Second Metal-containing Material
Micron Technology, Inc.
0 cites
US120027592024
Apparatuses Including a Conductive Contact Including a Dielectric Material Surrounded by a Conductive Material
0 cites
US119905282024
Assemblies Having Conductive Structures with Three or More Different Materials
0 cites
US118943052024
Microelectronic Devices Including Staircase Structures, and Related Memory Devices and Electronic Systems
0 cites
US118126102023
Three-dimensional Memory with Conductive Rails in Conductive Tiers, and Related Apparatus, Systems, and Methods
Micron Technology, Inc.
0 cites
US118007062023
Integrated Assemblies Having Conductive Posts Extending Through Stacks of Alternating Materials
0 cites
US117912682023
Tungsten Structures and Methods of Forming the Structures
Micron Technology, Inc.
0 cites
US117422822023
Conductive Interconnects
Micron Technology, Inc.
0 cites
US117055002023
Assemblies Having Conductive Structures with Three or More Different Materials
Micron Technology, Inc.
0 cites
US116006302023
Integrated Assemblies and Methods of Forming Integrated Assemblies
Micron Technology, Inc.
0 cites
US115944952023
Microelectronic Devices Including Conductive Levels Having Varying Compositions, and Related Memory Devices, Electronic Systems, and Methods
Micron Technology, Inc.
0 cites