Patents/Inventors

Rina Sasahara

AnnakaJP2 patents

3 Patents

US124214352025
Adhesive Composition for Flexible Printed-wiring Board (FPC), and Heat-curable Resin Film, Prepreg and FPC Substrate Containing Same
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US121103562024
Heat-curable Resin Composition
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US120124852024
Heat-curable Citraconimide Resin Composition
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites