Patents/Inventors

Rie Mizutani

NaganoJP3 patents

4 Patents

US123410882025
Wiring Board and Semiconductor Device Each Having Non-photosensitive Thermosetting Encapsulating Layer Over Photosensitive Resin Layer of Interconnect Structure
SHINKO ELECTRIC INDUSTRIES CO., Ltd.
0 cites
US117929272023
Interconnect Substrate
SHINKO ELECTRIC INDUSTRIES CO., Ltd.
0 cites
US117299142023
Wiring Board
SHINKO ELECTRIC INDUSTRIES CO.. Ltd.
0 cites
US117168102023
Wiring Board
SHINKO ELECTRIC INDUSTRIES CO., Ltd.
0 cites