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Richard Te Gan
Chandler, AZ
US
4 patents
5 Patents
US12125716
2024
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US11967507
2024
Tie Bar Removal for Semiconductor Device Packaging
NXP USA, Inc.
0 cites
US11791283
2023
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US11728285
2023
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US11705410
2023
Semiconductor Device Having Integrated Antenna and Method Therefor
NXP USA, Inc.
0 cites