Richard T. Schultz

10 Patents

• US125754492026

  Backside Power Delivery and Power Grid Pattern to Support 3D Die Stacking

  Advanced Micro Devices, Inc.

  0 cites
• US125640402026

  Power via with Reduced Resistance

  ATI Technologies ULC

  0 cites
• US124559992025

  Metal Zero Power Ground Stub Route to Reduce Cell Area and Improve Cell Placement at the Chip Level

  Advanced Micro Devices, Inc.

  0 cites
• US123083702025

  Cross Field Effect Transistors (xfets) in Integrated Circuits

  Advanced Micro Devices, Inc.

  0 cites
• US122740462025

  Cross FET SRAM Cell Layout

  Advanced Micro Devices, Inc.

  0 cites
• US122058972025

  Standard Cell Design Architecture for Reduced Voltage Droop Utilizing Reduced Contacted Gate Poly Pitch and Dual Height Cells

  Advanced Micro Devices, Inc.

  0 cites
• US118813932024

  Cross Field Effect Transistor Library Cell Architecture Design

  Advanced Micro Devices, Inc.

  0 cites
• US118626402024

  Cross Field Effect Transistor (XFET) Library Architecture Power Routing

  Advanced Micro Devices, Inc.

  0 cites
• US117788032023

  Cross FET SRAM Cell Layout

  Advanced Micro Devices, Inc.

  0 cites
• US117106982023

  Dual-track Bitline Scheme for 6T SRAM Cells

  Advanced Micro Devices, Inc.

  0 cites