5 Patents
- US125060592025Vertically Spaced Intra-level Interconnect Line Metallization for Integrated Circuit Devices
Intel Corporation
0 cites - US119488742024Vertically Spaced Intra-level Interconnect Line Metallization for Integrated Circuit Devices
Intel Corporation
0 cites - US118375422023Interconnects Having a Portion Without a Liner Material and Related Structures, Devices, and Methods
Intel Corporation
0 cites - US117642632023Gate-all-around Integrated Circuit Structures Having Depopulated Channel Structures Using Multiple Bottom-up Oxidation Approaches
Intel Corporation
0 cites - 0 cites