Patents/Inventors

Richard S. Graf

Gray, MEUS6 patents

2 Patents

US126223002026
Method of Assembling Partitioned Organic Substrate in a Flip Chip Package
Marvell Asia Pte Ltd
0 cites
US116826462023
IC Chip Package with Dummy Solder Structure Under Corner, and Related Method
MARVELL ASIA PTE Ltd.
0 cites