Patents/Inventors

Richard Patten

LangquaidDE3 patents

4 Patents

US122438562025
Fan Out Packaging Pop Mechanical Attach Method
Intel Corporation
0 cites
US122373052025
Integrated Circuit Package Having Wirebonded Multi-die Stack
Intel Corporation
0 cites
US119554622024
Package Stacking Using Chip to Wafer Bonding
Intel Corporation
0 cites
US117355702023
Fan Out Packaging Pop Mechanical Attach Method
Intel Corporation
0 cites