Patents/Inventors

Rennier Rodriguez

BulacanPH5 patents

6 Patents

US121702402024
Lead Frame for Improving Adhesive Fillets on Semiconductor Die Corners
Stmicroelectronics, Inc.
0 cites
US121598202024
Flat No-lead Package with Surface Mounted Structure
Stmicroelectronics, Inc.
0 cites
US120741002024
Flat No-lead Package with Surface Mounted Structure
Stmicroelectronics, Inc.
0 cites
US116887152023
Semiconductor Die with Multiple Contact Pads Electrically Coupled to a Lead of a Lead Frame
Stmicroelectronics, Inc.
0 cites
US116642392023
Lead Frame for Improving Adhesive Fillets on Semiconductor Die Corners
Stmicroelectronics, Inc.
0 cites
US115520072023
Modified Leadframe Design with Adhesive Overflow Recesses
Stmicroelectronics, Inc.
0 cites