Patents/Inventors

Ren-dou Lee

HsinchuTW4 patents

5 Patents

US122341452025
Methods for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121387352024
Multi-layered Windows for Use in Chemical-mechanical Planarization Systems
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118507022023
Chemical Mechanical Planarization Membrane
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118513252023
Methods for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US116886202023
Shiftless Wafer Blades
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites