Patents/Inventors

Rei-lin Chu

Hsinchu CityTW8 patents

8 Patents

US125817622026
Enhanced Trench Isolation Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124083542025
Method to Reduce Breakdown Failure in a MIM Capacitor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123343352025
Method of Optimizing Film Deposition Process in Semiconductor Fabrication by Using Gas Sensor
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US123344752025
3D Trench Capacitor for Integrated Passive Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121990292025
MIM Capacitor with a Symmetrical Capacitor Insulator Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118626122024
3D Trench Capacitor for Integrated Passive Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117842042023
Enhanced Trench Isolation Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115945932023
Method to Reduce Breakdown Failure in a MIM Capacitor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites