Patents/Inventors

Ravindranath V. Mahajan

Chandler, AZUS20 patents

19 Patents

US125719592026
Embedded Photonic Integrated Circuits
Intel Corporation
0 cites
US124944412025
BGA Stiffener Attachment with Low Eolife Adhesive Strength at High Solder Joint Stress Area Generated from Enabling Load
Intel Corporation
0 cites
US123477832025
Interconnect Architecture with Silicon Interposer and EMIB
Intel Corporation
0 cites
US122180402025
Nested Interposer with Through-silicon via Bridge Die
Intel Corporation
0 cites
US121598132024
Embedded Bridge Die with Through-silicon Vias
Intel Corporation
0 cites
US121425682024
Multi-die Ultrafine Pitch Patch Architecture of Interconnect Bridge Over Glass Layer and Method of Making
Intel Corporation
0 cites
US120613712024
Patch on Interposer Architecture for Low Cost Optical Co-packaging
Intel Corporation
0 cites
US119012992024
Interconnect Architecture with Silicon Interposer and EMIB
Intel Corporation
0 cites
US118943592024
Distributed Semiconductor Die and Package Architecture
Intel Corporation
0 cites
US118308632023
Dual-sided Co-packaged Optics for High Bandwidth Networking Applications
Intel Corporation
0 cites
US118324192023
Full Package Vapor Chamber with IHS
Intel Corporation
0 cites
US117568892023
Ultrathin Bridge and Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites
US117422932023
Multiple Die Package Using an Embedded Bridge Connecting Dies
Intel Corporation
0 cites
US117053772023
Stacked Die Cavity Package
Intel Corporation
0 cites
US116949592023
Multi-die Ultrafine Pitch Patch Architecture and Method of Making
Intel Corporation
0 cites
US116642932023
Solid State Thermoelectric Cooler in Silicon Backend Layers for Fast Cooling in Turbo Scenarios
Intel Corporation
0 cites
US115878512023
Embedded Bridge with Through-silicon Vias
Intel Corporation
0 cites
US115691732023
Bridge Hub Tiling Architecture
Intel Corporation
0 cites
US115575412023
Interconnect Architecture with Silicon Interposer and EMIB
Intel Corporation
0 cites