Patents/Inventors

Ravindranath Mahajan

Chandler, AZUS21 patents

22 Patents

US124698012025
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly
Intel Corporation
0 cites
US123667132025
Heat Dissipation Structures for Optical Communication Devices
Intel Corporation
0 cites
US122726562025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US122438062025
Nested Architectures for Enhanced Heterogeneous Integration
Intel Corporation
0 cites
US122388922025
Immersion Cooling for Integrated Circuit Devices
Intel Corporation
0 cites
US122241032025
Angled Inductor with Small Form Factor
Intel Corporation
0 cites
US122064102025
Programmable Logic Device with Fine-grained Disaggregation
Intel Corporation
0 cites
US121990482025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US121836492024
IC Package Including Multi-chip Unit with Bonded Integrated Heat Spreader
Intel Corporation
0 cites
US121425452024
Nested Architectures for Enhanced Heterogeneous Integration
Intel Corporation
0 cites
US120741022024
Structural Elements for Application Specific Electronic Device Packages
Intel Corporation
0 cites
US120481232024
Heat Dissipation Device Having Shielding/containment Extensions
Intel Corporation
0 cites
US118240182023
Heterogeneous Nested Interposer Package for IC Chips
0 cites
US118044182023
Direct Liquid Micro Jet (DLMJ) Structures for Addressing Thermal Performance at Limited Flow Rate Conditions
Intel Corporation
0 cites
US117988652023
Nested Architectures for Enhanced Heterogeneous Integration
Intel Corporation
0 cites
US117568562023
Package Architecture Including Thermoelectric Cooler Structures
Intel Corporation
0 cites
US117495772023
IC Package Including Multi-chip Unit with Bonded Integrated Heat Spreader
Intel Corporation
0 cites
US117422612023
Nested Architectures for Enhanced Heterogeneous Integration
Intel Corporation
0 cites
US117355332023
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US115950452023
Programmable Logic Device with Fine-grained Disaggregation
Intel Corporation
0 cites
US115812352023
IC Package Including Multi-chip Unit with Bonded Integrated Heat Spreader
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites