5 Patents
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- US124976942025Method of Forming Low-resistivity Ru ALD Through a Bi-layer Process and Related Structures
Samsung Electronics Co., Ltd.
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- US121805832024Methods of Forming Low Resistivity Titanium Nitride Thin Film in Horizontal Vias and Related Devices
Merck Patent GmbH
0 cites - US119763522024Methods of Vapor Deposition of Ruthenium Using an Oxygen-free Co-reactant
MERCK PATENT GmbH
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