26 Patents
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- US125966672026Multi-chip Module Including Integrated Circuit with Receiver Circuitry Implementing Transmit Signal Cancellation
Marvell Asia Pte., Ltd.
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- US124380952025Complex System-in-package Architectures Leveraging High-bandwidth Long-reach Die-to-die Connectivity Over Package Substrates
Eliyan Corp.
0 cites - US124302682025Efficient Signaling Scheme for High-speed Ultra Short Reach Interfaces
MARVELL ASIA PTE Ltd
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- US122484132025Universal Memory Interface Utilizing Die-to-die (D2D) Interfaces Between Chiplets
Eliyan Corporation
0 cites - US122484182025Efficient Signaling Scheme for High-speed Ultra Short Reach Interfaces
MARVELL ASIA PTE Ltd
0 cites - US122484192025Interface Conversion Circuitry for Universal Chiplet Interconnect Express (ucie)
Eliyan Corporation
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- US122044822025Memory Chiplet with Efficient Mapping of Memory-centric Interface to Die-to-die (D2D) Unit Interface Modules
Eliyan Corporation
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- US119831392024Multi-chip Module with Integrated Circuit Chip Having Power-efficient Hybrid Circuitry
Marvell Asia Pte, Ltd.
0 cites - 0 cites
- US118803212024Efficient Signaling Scheme for High-speed Ultra Short Reach Interfaces
Marvell Asia Pte, Ltd.
0 cites - US118550432023Complex System-in-package Architectures Leveraging High-bandwidth Long-reach Die-to-die Connectivity Over Package Substrates
Eliyan Corporation
0 cites - 0 cites
- US118223692023Efficient Signaling Scheme for High-speed Ultra Short Reach Interfaces
MARVELL ASIA PTE Ltd
0 cites