12 Patents
- US123880192025Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites - US122835352025IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US121762922024Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US120516472024Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites - US119843772024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119358082024IC Die and Heat Spreaders with Solderable Thermal Interface Structures for Multi-chip Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US119232672024IC Die with Solderable Thermal Interface Structures for Assemblies Including Solder Array Thermal Interconnects
Intel Corporation
0 cites - US118173902023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
0 cites - US117053982023Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites - US116409422023Microelectronic Component Having Molded Regions with Through-mold Vias
Intel Corporation
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