12 Patents
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- US124530542025Cooling Assembly with Strap Element to Diminish Lateral Movement of Cooling Mass During Installation of the Cooling Mass
Intel Corporation
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- US123099662025Thermally Conductive Chamber with Stiffening Structure for Thermal Cooling Assembly of Semiconductor Chip Package Under High Loading Force
Intel Corporation
0 cites - US122793952025Patterned Bolster Plate and Composite Back Plate for Semiconductor Chip LGA Package and Cooling Assembly Retention
Intel Corporation
0 cites - US121319772024Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
Intel Corporation
0 cites - US118429432023Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
INTEL CORPORATION
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- US115575292023Mechanism Combining Fastener Captivation and Assembly Tilt Control for Microprocessor Thermal Solutions
Intel Corporation
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