13 Patents
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- US121598052024Method for Producing Wafers with Modification Lines of Defined Orientation
Siltectra GmbH
0 cites - US121513142024Device and Method for Applying Pressure to Stress-producing Layers for Improved Guidance of a Separation Crack
Siltectra GmbH
0 cites - US121070172024Method and Apparatus for Producing at Least One Modification in a Solid Body
INFINEON TECHNOLOGIES AG
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- US118698102024Method for Reducing the Thickness of Solid-state Layers Provided with Components
Siltectra GmbH
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- US118223072023Laser Conditioning of Solid Bodies Using Prior Knowledge from Previous Machining Steps
Siltectra GmbH
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- US117127492023Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices
Infineon Technologies AG
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- US115519812023Method and Apparatus for Producing at Least One Modification in a Solid Body
Infineon Technologies AG
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