23 Patents
- US125123802025Semiconductor Packages Including a Package Body with Grooves Formed Therein
Infineon Technologies AG
0 cites - 0 cites
- US124128152025Semiconductor Package and Method of Manufacturing a Semiconductor Package
Infineon Technologies Austria AG
0 cites - US123477542025Package with Load Terminals on Which Coupled Power Component and Logic Component Are Mounted
Infineon Technologies AG
0 cites - US122648672025Cryostat Socket for Holding an Ion Trap Device Mounted on a Substrate in a Cryostat
Infineon Technologies Austria AG
0 cites - 0 cites
- US122058702025Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites - US121366232024Multi-device Semiconductor Chip with Electrical Access to Devices at Either Side
Infineon Technologies Austria AG
0 cites - US120682132024Chip Package and Semiconductor Arrangement Having Thermally Conductive Material in Contact with a Semiconductor Chip and Methods of Forming Thereof
Infineon Technologies AG
0 cites - 0 cites
- US119843922024Semiconductor Package Having a Chip Carrier with a Pad Offset Feature
Infineon Technologies AG
0 cites - US119786932024Semiconductor Device Package Comprising Side Walls Connected with Contact Pads of a Semiconductor Die
Infineon Technologies AG
0 cites - 0 cites
- US119292982024Molded Semiconductor Package with Dual Integrated Heat Spreaders
Infineon Technologies AG
0 cites - 0 cites
- US119159992024Semiconductor Device Having a Carrier, Semiconductor Chip Packages Mounted on the Carrier and a Cooling Element
Infineon Technologies AG
0 cites - US118044242023Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip
Infineon Technologies Austria AG
0 cites - 0 cites
- US117157192023Semiconductor Package and Method of Forming a Semiconductor Package
Infineon Technologies AG
0 cites - US116886702023Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites - US116768812023Semiconductor Package, Semiconductor Assembly and Method for Fabricating a Semiconductor Package
Infineon Technologies AG
0 cites - 0 cites
- US116005582023Plurality of Transistor Packages with Exposed Source and Drain Contacts Mounted on a Carrier
Infineon Technologies AG
0 cites