Patents/Inventors

Rajen Manicon Murugan

Dallas, TXUS32 patents

34 Patents

US125990022026
Substrate-integrated Waveguide
TEXAS INSTRUMENTS INCORPORATED
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US124890612025
Semiconductor Device with Multiple Dies
TEXAS INSTRUMENTS INCORPORATED
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US124892112025
Electronic Device with Patch Antenna in Packaging Substrate
TEXAS INSTRUMENTS INCORPORATED
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US124447022025
Flip-chip Enhanced Quad Flat No-lead Electronic Device with Conductor Backed Coplanar Waveguide Transmission Line Feed in Multilevel Package Substrate
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US124380722025
Multilayer Package Substrate with Stress Buffer
TEXAS INSTRUMENTS INCORPORATED
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US124180972025
Microelectronic Device Package Including Antenna and Semiconductor Device
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US124069152025
Plated Metal Layer in Power Packages
Texas Instruments Incorporated
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US124009452025
Electronic Device Multilevel Package Substrate for Improved Electromigration Performance
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US123947422025
Interconnect Structure for High Power Gan Module Including a Printed Planar Interconnect Line and Method for Making the Same
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US123811392025
Electronic Device and Multilevel Package Substrate with Elevated Trace Features for Solder And/or Die Confinement and Method for Fabricating the Electronic Device
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US123228562025
Antenna in Package Having Antenna on Package Substrate
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US122665962025
Semiconductor Device with a Power Converter Module Connected to Connection Assembly
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US122438492025
Passives to Facilitate Mold Compound Flow
TEXAS INSTRUMENTS INCORPORATED
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US122439112025
Integrated Circuit Package for Isolation Dies
TEXAS INSTRUMENTS INCORPORATED
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US122244802025
Microelectronic Device Package Including Antenna Horn and Semiconductor Device
TEXAS INSTRUMENTS INCORPORATED
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US122180362025
Package Substrate Having Integrated Passive Device(s) Between Leads
TEXAS INSTRUMENTS INCORPORATED
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US122118002025
Semiconductor Package with Shunt and Patterned Metal Trace
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US121485562024
Integrated Magnetic Assembly
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US121132932024
Antenna-on-package Including Multiple Types of Antenna
TEXAS INSTRUMENTS INCORPORATED
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US120402652024
High-frequency Ceramic Packages with Modified Castellation and Metal Layer Architectures
TEXAS INSTRUMENTS INCORPORATED
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US119786992024
Electronic Device Multilevel Package Substrate for Improved Electromigration Preformance
TEXAS INSTRUMENTS INCORPORATED
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US119787092024
Integrated System-in-package with Radiation Shielding
TEXAS INSTRUMENTS INCORPORATED
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US119554792024
Packaged Semiconductor Device
TEXAS INSTRUMENTS INCORPORATED
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US119012712024
High Current Packages with Reduced Solder Layer Count
TEXAS INSTRUMENTS INCORPORATED
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US118814602024
Ceramic Semiconductor Package Seal Rings
TEXAS INSTRUMENTS INCORPORATED
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US118377752023
Microelectronic Device Package Including Antenna and Semiconductor Device
TEXAS INSTRUMENTS INCORPORATED
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US117841132023
Multilayer Package Substrate with Stress Buffer
TEXAS INSTRUMENTS INCORPORATED
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US117841142023
Plated Metal Layer in Power Packages
TEXAS INSTRUMENTS INCORPORATED
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US116005552023
Package Substrate Having Integrated Passive Device(s) Between Leads
Texas Instruments Incorporated
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US116005812023
Packaged Electronic Device and Multilevel Lead Frame Coupler
TEXAS INSTRUMENTS INCORPORATED
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US116009322023
Antenna-on-package Including Multiple Types of Antenna
TEXAS INSTRUMENTS INCORPORATED
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US115878912023
Ceramic Semiconductor Package Seal Rings
TEXAS INSTRUMENTS INCORPORATED
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US115577222023
Hall-effect Sensor Package with Added Current Path
TEXAS INSTRUMENTS INCORPORATED
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US115454202023
High Current Packages with Reduced Solder Layer Count
Texas Instruments Incorporated
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