Patents/Inventors

Rajasekaran Swaminathan

Chandler, AZUS7 patents

8 Patents

US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US123880192025
Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites
US120806322024
Glass Core Package Substrates
Advanced Micro Devices, Inc.
0 cites
US120516472024
Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites
US118173642023
BGA STIM Package Architecture for High Performance Systems
Intel Corporation
0 cites
US117422932023
Multiple Die Package Using an Embedded Bridge Connecting Dies
Intel Corporation
0 cites
US117053982023
Pitch Translation Architecture for Semiconductor Package Including Embedded Interconnect Bridge
Intel Corporation
0 cites