Raja Swaminathan

10 Patents

• US125884862026

  Connecting Semicondcutor Device Assembly Components Using Interconnect Dies with Spacer Component Coupled to a Portion of an Interconnect Die

  ADVANCED MICRO DEVICES, Inc.

  0 cites
• US123811272025

  Semiconductor Chip Device Integrating Thermal Pipes in Three-dimensional Packaging

  ADVANCED MICRO DEVICES, Inc.

  0 cites
• US123746452025

  Electronic Device Including Dies and an Interconnect Coupled to the Dies and Processes of Forming the Same

  Advanced Micro Devices, Inc.

  0 cites
• US122768502025

  Fanout Module Integrating a Photonic Integrated Circuit

  ADVANCED MICRO DEVICES, Inc.

  0 cites
• US122781502025

  Semiconductor Package with Annular Package Lid Structure

  Advanced Micro Devices, Inc.

  0 cites
• US122666112025

  Mixed Density Interconnect Architectures Using Hybrid Fan-out

  ADVANCED MICRO DEVICES, Inc.

  0 cites
• US121659812024

  3D Semiconductor Package with Die-mounted Voltage Regulator

  Advanced Micro Devices, Inc.

  0 cites
• US119118392024

  Low Temperature Hybrid Bonding

  ADVANCED MICRO DEVICES, Inc.

  0 cites
• US118308172023

  Creating Interconnects Between Dies Using a Cross-over Die and Through-die Vias

  ATI TECHNOLOGIES ULC

  0 cites
• US117093272023

  Fanout Module Integrating a Photonic Integrated Circuit

  ADVANCED MICRO DEVICES, Inc.

  0 cites